How does improve the life of UFO LED high bay light ?
We as consumers who want to buy something that can last longer, and UFO LED high bay light are no exception.So how do you improve the life of UFO LED high bay light?
Firstly, the quality of the packaging material of the UFO LED high bay light is strictly controlled, such as conductive glue, silicone, phosphor powder, epoxy, solid crystal materials, foundation etc.
Secondly, the design of the structure of the structure of the structure of the lamp of the UFO LED high bay light is designed, such as unreasonable packaging can produce stress, cause fracture and so on.
Then,improve technology. Such as solidification temperature, pressure welding, sealing, loading and time, etc., should be made strictly according to the requirements.
To improve the life of the power supply of UFO LED high bay light, it is necessary to choose high quality and long life capacitance to improve the life of the power supply.Reducing the current and working voltage of the ripple through the capacitor;To improve the efficiency of power supply and reduce thermal resistance of components.Make waterproof processing and other protective measures, and pay attention to the choice of conductive glue.
The design of heat dissipation is a key factor in the life of the lamp.With a chip of the same quality in the different design of lamps and lanterns, the difference in life, even can reach dozens of times, so, a kind of lamps and lanterns design success or failure, the cooling system plays a decisive role.
LED heat dissipation generally include cooling system level heat dissipation and encapsulation level, to reduce the thermal resistance of lamps and lanterns must consider these two kinds of heat at the same time, the heat level packaging is in LED light source in the process of production of packaging materials, packaging structure and the design of the technological level so as to achieve the aim of heat dissipation.
In terms of packaging thermal design, the main existing silicon-based flip chip structure, metal cooling circuit board structure, a solid crystal material, epoxy resin material such as heat dissipation.Slopes cooling system is mainly based on the research of the related technologies, thus for innovation and improvement of radiator, and with the popularity of high power LED, power is becoming more and more big, at present, the system level heat mainly include thermoelectric refrigeration cooling, heat pipe cooling and air cooling methods of forced heat dissipation structure.
Solving the problem of heat dissipation is an effective way to improve the life of UFO LED high bay lights, so further research and innovation is needed.
Firstly, the quality of the packaging material of the UFO LED high bay light is strictly controlled, such as conductive glue, silicone, phosphor powder, epoxy, solid crystal materials, foundation etc.
Secondly, the design of the structure of the structure of the structure of the lamp of the UFO LED high bay light is designed, such as unreasonable packaging can produce stress, cause fracture and so on.
Then,improve technology. Such as solidification temperature, pressure welding, sealing, loading and time, etc., should be made strictly according to the requirements.
To improve the life of the power supply of UFO LED high bay light, it is necessary to choose high quality and long life capacitance to improve the life of the power supply.Reducing the current and working voltage of the ripple through the capacitor;To improve the efficiency of power supply and reduce thermal resistance of components.Make waterproof processing and other protective measures, and pay attention to the choice of conductive glue.
The design of heat dissipation is a key factor in the life of the lamp.With a chip of the same quality in the different design of lamps and lanterns, the difference in life, even can reach dozens of times, so, a kind of lamps and lanterns design success or failure, the cooling system plays a decisive role.
LED heat dissipation generally include cooling system level heat dissipation and encapsulation level, to reduce the thermal resistance of lamps and lanterns must consider these two kinds of heat at the same time, the heat level packaging is in LED light source in the process of production of packaging materials, packaging structure and the design of the technological level so as to achieve the aim of heat dissipation.
In terms of packaging thermal design, the main existing silicon-based flip chip structure, metal cooling circuit board structure, a solid crystal material, epoxy resin material such as heat dissipation.Slopes cooling system is mainly based on the research of the related technologies, thus for innovation and improvement of radiator, and with the popularity of high power LED, power is becoming more and more big, at present, the system level heat mainly include thermoelectric refrigeration cooling, heat pipe cooling and air cooling methods of forced heat dissipation structure.
Solving the problem of heat dissipation is an effective way to improve the life of UFO LED high bay lights, so further research and innovation is needed.
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