The heat dissipation and the quality of the chip of LED high bay light
Overcome a single led heat conduction, is not the same as overcome the problem of LED high bay light heat conduction. with high power, large size, the development of high brightness chip, led devices and heat dissipation problems of LED high bay light must be solved.High power LED high bay light greatly better than the ordinary small power in the cooling sexual, electrical channel and thermal channel separation, make the heat dissipation performance greatly ascension.
However, high-power LED high bay light is used in the special place, or to use for bad environment, these lamps are generally above IP65 protection grade, if shell for non-metallic materials, although the led link on the aluminum plate, but the heat on the aluminum plate surface is not very good conduction to the outside,but also heat can make the aluminum substrate temperature rising fast, cause the LEDs failure is expedite, even failure.
In theory heat dissipation design of LED high bay light has many difficulties, Mainly to the relative effects of the convection and conduction. First of all, convection design requirements for the internal structure of the lamps and lanterns is very high,conduction need takes a lot of material objects.Many data in design lab, but in actual use may be is another kind of circumstance, because of using the environment different, the beginning of a lot of theoretical data are likely to fail. The radiator of TEK Lighting after repeated experiments in different environments, have been effective to a certain extent,solved the worry.
TEK Lighting LED high bay light not only solve the heat dissipation of lamps and lanterns and guarantee the quality of the chip, Consumer will have a good lighting experience.
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