How to improve the life of UFO LED high bay light?
We as consumers want to buy something can use more long, the UFO LED high bay light is no exception.So how to improve the life of the UFO LED high bay light? First of all, to strictly control the quality of UFO LED high bay light encapsulation materials, such as conductive adhesive, silica gel, phosphor, epoxy, solid crystal material, base, etc.Secondly, the rational design of UFO LED high bay light encapsulation structure, such as unreasonable encapsulation yield stress, fracture, etc.Then, to improve the UFO LED high bay light technology, such as curing temperature, bonding, sealing glue, and time will be in strict accordance with the requirement.
Increasing the drive power of UFO LED high bay light life, need to choose high quality, long life of the capacitor is an effective way to improve life drive power;Reduce through the capacitance of ripple current and working voltage;Improve the efficiency of the power drive, lower thermal resistance of components; Protective measures such as good waterproof processing, at the same time should pay attention to the choice of thermal conductive adhesive.
Increasing the drive power of UFO LED high bay light life, need to choose high quality, long life of the capacitor is an effective way to improve life drive power;Reduce through the capacitance of ripple current and working voltage;Improve the efficiency of the power drive, lower thermal resistance of components; Protective measures such as good waterproof processing, at the same time should pay attention to the choice of thermal conductive adhesive.
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The stand or fall of thermal design is one of the key factors of UFO LED high bay light life. With a chip of the same quality in the different design of lamps and lanterns, the difference in life, even can reach dozens of times, so, a kind of lamps and lanterns design success or failure, the cooling system plays a decisive role.
heat dissipation generally include cooling system level heat dissipation and encapsulation level, to reduce the thermal resistance of lamps and lanterns must consider these two kinds of heat at the same time, the heat level packaging is in LED light source in the process of production of packaging materials, packaging structure and the design of the technological level so as to achieve the aim of heat dissipation.
In terms of packaging thermal design, the main existing silicon-based flip chip structure, metal cooling circuit board structure, a solid crystal material, epoxy resin material such as heat dissipation.Slopes cooling system is mainly based on the research of the related technologies, thus for innovation and improvement of radiator, and with the popularity of high power LED, power is becoming more and more big, at present, the system level heat mainly include thermoelectric refrigeration cooling, heat pipe cooling and air cooling methods of forced heat dissipation structure.Good heat dissipation problem is an effective way to increase the UFO LED high bay light life, so you need to further research and innovation.
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